Ultrasonic Wire Bonder

In order to achieve low vibration and high speed, we have newly designed the material of the frame, the weight of the bonding head, and the use of linear motors for the XY axis.

Able to recognize multiple points at once,it reduce time for PRS and improves Productivity．
Automatically measure and saves deformation data after bonding.

Faster UPH&Smaller size. Exclusive wire bonder for discrete lead frame.