Ultrasonic Wire Bonder
Rotary head type
Able to recognize multiple points at once,it reduce time for PRS and improves Productivity．
Automatically measure and saves deformation data after bonding.
Faster X・Y・Z・θ-axis movement for faster bonding tact .
Applicable to wide variety of wire size by conversion kit.
Improved recognition system.
Faster UPH&Smaller size. Exclusive wire bonder for discrete lead frame.