Ultrasonic Metal Bonder

Ultrasonic Automatic Metal Bonder

• Able to save and judge each bonding point's wave form.
• X・Y・Z・θ-axis loaded.
• Recognition system equipped for automatic correction.

Ultrasonic Spot Bonder

• Able to set 4 types of oscillation trigger, soft start, variable amplitude flexibly for best bonding condition.
• Able to save and judge each bonding point's wave form.

Mini Metal Bonder

• It is equipped with wire bonder REBO series' transducer system and capable of spot bonding．
• It is able to monitor 4 types of waveform while bonding.

※Measuring instruments (such as oscilloscope) is necessary for monitoring.