1. 音が伝える未来へ|超音波工業株式会社
  2. Ultrasonic Engineering
  3. Product
  4. Ultrasonic Wire Bonder
  5. Rotary head type

Rotary head type

REBO-9W

REBO-9W
Characteristics
  • Bonder Exchange Kit enables REBO-9 to handle large, medium, small wire and ribbon . This enables customers to save manufacturing cost.
  • New Dual frequency transducer is available for large wire bonding head. By switching between 110 kHz and 40 kHz arbitrarily, It enables optimum bonding on corresponding bond point.
  • Able to manage 80、110、120kHz in 1 generator.
  • Able to recognize multiple points at once,it reduce time for PRS and improves Productivity.(optional)
  • Automatically measure and saves deformation data after bonding.
  • It would greatly reduce pattern recognition errors.

REBO-9W specification

Uses Small Wire Medium Wire Large Wire Ribbon Cu Wire
Size of wire 25-50μm 75-150μm 100~500μm
600μm(optional)
W:0.5mm~2.0mm
T:0.1mm〜0.3mm
200~500μm
Wire material Aluminum copper
Frequency 120kHz 110kHz 110kHz/40kHz
※110kHz/40kHz 40kHz is only arailable for dual-frequency transducer
80kHz
Bonding area X:300mm×Y:300mm
Basic OS Windows 8 ※1
Dimensions(mm) 754(W)X1325(D)X1630(H) ※2
Mass weight Approx 850kg
Power supply Three phase AC200V~240VA

※1.Windows is a registered trademark of Microsoft Corporation in the United States.

※2.The beetling parts such as a monitor, signal tower,and other screws are excluded.

REBO-9

REBO-9
Characteristics
  • Bonder Exchange Kit enables REBO-9 to handle large, medium, small wire and ribbon . This enables customers to save manufacturing cost.
  • Able to manage 80、110、120kHz in 1 generator.
  • Able to recognize multiple points at once,it reduce time for PRS and improves Productivity.(optional)
  • Automatically measure and saves deformation data after bonding.
  • It would greatly reduce pattern recognition errors.

REBO-9 specification

Uses Small Wire Medium Wire Large Wire Ribbon Cu Wire
Size of wire 25-50μm 75-150μm 100-500μm W:0.5mm~2.0mm
T:0.1mm〜0.3mm
200~500μm
Wire material Aluminum copper
Frequency 120kHz 110kHz 80kHz
Bonding area X:130mm×Y:160mm
Basic OS Windows 8 ※1
Dimensions(mm) 1725(W)×1225(D)×1630(H)㎜ ※2
Mass weight Approx 980kg
Power supply AC200V~240VA

※1.Windows is a registered trademark of Microsoft Corporation in the United States.

※2.The beetling parts such as a monitor, signal tower,and other screws are excluded.

REBO-9T

REBO-9T
Characteristics
  • Bonder Exchange Kit enables REBO-9 to handle large, medium, small wire and ribbon . This enables customers to save manufacturing cost.
  • Able to manage 80、110、120kHz in 1 generator.
  • Able to recognize multiple points at once,it reduce time for PRS and improves Productivity.(optional)
  • Automatically measure and saves deformation data after bonding.
  • It would greatly reduce pattern recognition errors.

REBO-9T specification

Uses Small Wire Medium Wire Large Wire Ribbon Cu Wire
Size of wire 25~50μm 75~150μm 100~500μm W:0.5mm~2.0mm
T:0.1mm〜0.3mm
200~500μm
Wire material Aluminum copper
Frequency 120kHz 110kHz 80kHz
Bonding area X:130mm×Y:160mm
Basic OS Windows 8 ※1
Dimensions(mm) 1725(W)×1225(D)×1630(H) ※2
Mass weight Approx 620kg
Power supply AC200V~240VA

※1. Windows is a registered trademark of Microsoft Corporation in the United States.

※2.The beetling parts such as a monitor, signal tower,and other screws are excluded.