1. 音が伝える未来へ|超音波工業株式会社
  2. Ultrasonic Engineering
  3. Product
  4. Ultrasonic Metal Bonder
  5. Mini Metal Bonder

Mini Metal Bonder

Metal-80

Metal-80
Metal-80
Characteristics
  • It is equipped with wire bonder REBO series' transducer system and capable of spot bonding.
  • It is able to monitor 4 types of waveform while bonding.
    ※Measuring instruments (such as oscilloscope) is necessary for monitoring.
  • Capable of lower bonding force than air-press type metal bonder(compared to our products).
  • Applied changeable tool as bonding horn.
  • It enables access to workpiece's deep bonding point.
    ※The distance from horn to tool tip is approximately 58mm. Z-axis stroke is approximately 20mm.
  • It can be installed into automated production system with PLC external controller.

Mini Metal Bonder specification

Model Metal-80
Power 94W
Frequency 80kHz
Force range 10~60N
External output Attached with connector for monitor.
Transducer current waveform, frequency relative offset waveform
Transducer voltage waveform, sink waveform.
※Oscilloscope is not attached.
Dimension (mm) Generator:402×450×181㎜(Exclude protruding object such as switch)
Machine:250×320×440㎜(Exclude protruding object such as lever)