Mini Metal Bonder
- It is equipped with wire bonder REBO series' transducer system and capable of spot bonding.
- It is able to monitor 4 types of waveform while bonding.
※Measuring instruments (such as oscilloscope) is necessary for monitoring.
- Capable of lower bonding force than air-press type metal bonder(compared to our products).
- Applied changeable tool as bonding horn.
- It enables access to workpiece's deep bonding point.
※The distance from horn to tool tip is approximately 58mm. Z-axis stroke is approximately 20mm.
- It can be installed into automated production system with PLC external controller.
Mini Metal Bonder specification
|External output||Attached with connector for monitor.
Transducer current waveform, frequency relative offset waveform
Transducer voltage waveform, sink waveform.
※Oscilloscope is not attached.
|Dimension (mm)||Generator：402×450×181㎜（Exclude protruding object such as switch)
Machine：250×320×440㎜（Exclude protruding object such as lever)